SMT Assembly — Components are mounted by placing them directly onto the PCB’s surface. We have the capabilities to assemble
SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single- or
double-sided component insertions. Our production facilities can assemble the following SMT types:
Ball Grid Array (BGA)
Ultra-Fine Ball Grid Array (uBGA)
Quad Flat Pack No-Lead (QFN)
Quad Flat Package (QFP)
Small Outline Integrated Circuit (SOIC)
Plastic Leaded Chip Carrier (PLCC)
Package-On-Package (PoP)
Small Chip Packages (pitch of 0.2 mm
